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  this is information on a product in full production. october 2012 doc id 022399 rev 1 1/7 7 STPS20L60C-Y automotive power schottky rectifier datasheet ? production data features low forward voltage drop negligible switching losses low thermal resistance avalanche capability specified aec-q101 qualified description this dual center tap schottk y rectifier is suited for switched mode power supplies and high frequency dc to dc converters. packaged in d 2 pak, this device is intended for use in high frequency inverters for automotive applications. table 1. device summary i f(av) 2 x 10 a v rrm 60 v t j (max) 150 c v f (max) 0.56 v a1 k a2 k a1 a2 d 2 pak stps20l60cgy-tr www.st.com
characteristics STPS20L60C-Y 2/7 doc id 022399 rev 1 1 characteristics when the diodes 1 and 2 are used simultaneously: ? t j(diode 1) = p (diode1) x r th(j-c) (per diode) + p (diode2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.014 x i f 2 (rms) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 30 a i f(av) average forward current t c = 140 c ?? = 0.5 per diode per device 10 20 a i fsm surge non repetitive forward current t p = 10 ms, sinusoidal 220 a i rrm repetitive peak reverse current t p = 2 s square, f = 1 khz 1a p arm repetitive peak avalanche power t p = 1 s, t j = 25 c 5800 w t stg storage temperature range -65 to + 175 c t j operating junction temperature range (1) -40 to + 150 c dv/dt critical rate of rise reverse voltage 10000 v/s 1. condition to avoid thermal r unaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal resistances symbol parameter value unit r th (j-c) junction to case per diode to t a l 1.6 0.85 ? c/w r th (c) coupling 0.1 ? c/w table 4. static electrical characteristics (per diode) symbol parameter tests conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 350 a t j = 125 c 65 95 ma v f (1) forward voltage drop t j = 25 c i f = 10 a 0.6 v t j = 125 c i f = 10 a 0.48 0.56 t j = 25 c i f = 20 a 0.74 t j = 125 c i f = 20 a 0.62 0.7 1. pulse test: t p = 380 s, ? < 2%
STPS20L60C-Y characteristics doc id 022399 rev 1 3/7 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average current versus ambient temperature ( ?? = 0.5) (per diode) 0 1 2 3 4 5 6 7 8 9 10 11 12 0 1 2 3 4 5 6 7 8 pf(av)(w) if(av) (a) t =tp/t tp = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 150 0 2 4 6 8 10 12 if(av)(a) t =tp/t tp tamb(c) rth(j-a)=15c/w rth(j-a)=rth(j-c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. relative variation of thermal transient impedance junction to case versus pulse duration 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 160 180 200 im(a) t(s) i m t =0.5 tc=25c tc=75c tc=100c 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 zth(j-c)/rth(j-c) tp(s) t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse
characteristics STPS20L60C-Y 4/7 doc id 022399 rev 1 figure 9. forward voltage drop versus forward current (maximum values, per diode) figure 7. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 8. junction capacitance versus reverse voltage applied (typical values, per diode) 0 5 10 15 20 25 30 35 40 45 50 55 60 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 ir(ma) vr(v) tc=25c tc=75c tc=100c tc=125c tc=150c tc=50c 1 10 100 0.1 0.2 0.5 1.0 2.0 c(nf) vr(v) f=1mhz tj=25c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0.1 1.0 10.0 100.0 ifm(a) vfm(v) tj=25c tj=125c tj=150c (typical values)
STPS20L60C-Y package information doc id 022399 rev 1 5/7 2 package information epoxy meets ul94, v0 cooling method: by conduction (method c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. footprint (dimensions in mm) table 5. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
ordering information STPS20L60C-Y 6/7 doc id 022399 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps20l60cgy-tr stps20l60cgy d 2 pak 1.48 g 1000 tape and reel table 7. document revision history date revision changes 24-oct-2012 1 initial release.
STPS20L60C-Y doc id 022399 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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